Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414232 | Substrate structure | Pei-Geng Weng, Fang-Lin Tsai, Yih-Jenn Jiang | 2025-09-09 |
| 11791300 | Electronic package and circuit structure thereof | Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Yih-Jenn Jiang | 2023-10-17 |