Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199331 | Fabrication method of electronic package having embedded package block | Fu-Tang Huang | 2019-02-05 |
| 10192838 | Fabrication method of packaging substrate | Chien-Lung Chuang, Po-Yi Wu, Yih-Jenn Jiang | 2019-01-29 |
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu | 2018-08-14 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu | 2018-02-20 |
| 9875981 | Semiconductor device having conductive vias | Yi-Che Lai, Shih-Kuang Chiu | 2018-01-23 |
| 9812340 | Method of fabricating semiconductor package having semiconductor element | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu, Fu-Tang Huang | 2017-11-07 |
| 9502333 | Semiconductor device having conductive vias | Yi-Che Lai, Shih-Kuang Chiu | 2016-11-22 |
| 9324585 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu, Fu-Tang Huang | 2016-04-26 |
| 9041189 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Shih-Kuang Chiu | 2015-05-26 |
| 8866293 | Semiconductor structure and fabrication method thereof | Yi-Hung Lin, Sui-An Kao, Yi-Hsin Chen, Feng-Lung Chien | 2014-10-21 |
| 8680692 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu | 2014-03-25 |