Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224108 | Coil module | Tsang-Feng Wu, Yuan Han, Tzu-Chieh Kao, Chien-Hung Lin, Kuang-Lun LEE +17 more | 2025-02-11 |
| 12160112 | Wireless transmission module | Mao-Chun Chen, Kun-Ying Lee, Yuan Han, Tsang-Feng Wu | 2024-12-03 |
| 11936198 | Coil module | Hsiang-Hui Hsu, Chien-Hung Lin | 2024-03-19 |
| 11817253 | Coil module | Tsang-Feng Wu, Yuan Han, Tzu-Chieh Kao, Chien-Hung Lin, Kuang-Lun LEE +17 more | 2023-11-14 |
| 11581132 | Magnetic conductive substrate and coil assembly | Hsiang-Hui Hsu, Ni-Ni Lai, Chien-Hung Lin | 2023-02-14 |
| 11050298 | Wireless device | Hsiang-Hui Hsu, Chien-Hung Lin | 2021-06-29 |
| 10855108 | Wireless device | Mao-Chun Chen, Hsiang-Hui Hsu, Kuo-Jui Lee, Chien-Hung Lin | 2020-12-01 |
| 10840738 | Wireless device | Mao-Chun Chen, Hsiang-Hui Hsu, Kuo-Jui Lee, Chien-Hung Lin | 2020-11-17 |
| 10615629 | Wireless device | Chien-Hung Lin, Hsiang-Hui Hsu, Ni-Ni Lai | 2020-04-07 |
| 9793743 | Wireless charging device for charging a plurality of wireless power receiving apparatus and charging method thereof | Mao-Chun Chen, Chien-Hung Lin, Sheng-Tai Hsu, Ni-Ni Lai, Hsiang-Huims Hsu | 2017-10-17 |
| 9595383 | Wireless charging coil PCB structure | Takahiro Oishi, Chris T. Burket, Chao-Neen CHANG, Alan Wu | 2017-03-14 |
| 8866293 | Semiconductor structure and fabrication method thereof | Yi-Hung Lin, Meng-Tsung Lee, Sui-An Kao, Yi-Hsin Chen | 2014-10-21 |
| 8569162 | Conductive bump structure on substrate and fabrication method thereof | Yi-Hung Lin, Yi-Hsin Chen | 2013-10-29 |
| 7489037 | Semiconductor device and fabrication method thereof | Chao-Dung Suo, Yi-Hsin Chen | 2009-02-10 |
| 7341949 | Process for forming lead-free bump on electronic component | Huang-Chuan Chang, Chun-Sheng Ho | 2008-03-11 |
| 6753609 | Circuit probing contact pad formed on a bond pad in a flip chip package | Randy H. Y. Lo, Chun-Chi Ke | 2004-06-22 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Chih-Shun Chen, Po-Hao Yuan, Shih-Kuang Chiu, Ke Yang | 2004-02-17 |
| 6348401 | Method of fabricating solder bumps with high coplanarity for flip-chip application | Chih-Shun Chen, Chao-Dung Suo, Jui-Meng Jao, Ke Yang | 2002-02-19 |
| 6258705 | Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip | Randy H. Y. Lo, Chun-Chi Ke | 2001-07-10 |