Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11533306 | Processes and method for safe of use, monitoring and management of device accounts in terminal manner | Chih-Hung Lee, Jye Luo, Chih-Chung Chen | 2022-12-20 |
| 6713850 | Tape carrier package structure with dummy pads and dummy leads for package reinforcement | Po-Hao Yuan, Chi-Chuan Wu | 2004-03-30 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Po-Hao Yuan, Shih-Kuang Chiu, Feng-Lung Chien, Ke Yang | 2004-02-17 |
| 6348401 | Method of fabricating solder bumps with high coplanarity for flip-chip application | Chao-Dung Suo, Jui-Meng Jao, Ke Yang, Feng-Lung Chien | 2002-02-19 |