Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501164 | Multi-chip semiconductor package with heat dissipating structure | Ying Chen, Jeng-Yuan Lai, Chiung-Kai Yang | 2002-12-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501164 | Multi-chip semiconductor package with heat dissipating structure | Ying Chen, Jeng-Yuan Lai, Chiung-Kai Yang | 2002-12-31 |