Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE39957 | Method of making semiconductor package with heat spreader | Chien-Ping Huang, Cheng-Hsu Hsiao | 2007-12-25 |
| 7148561 | Ball grid array substrate strip with warpage-preventive linkage structure | Chien-Ping Huang, Isaac Yu | 2006-12-12 |
| 7074645 | Fabrication method of semiconductor package with heat sink | Chien-Ping Huang, Cheng-Hsu Hsiao | 2006-07-11 |
| 6867487 | Flash-preventing semiconductor package | Chien-Ping Huang | 2005-03-15 |
| 6844622 | Semiconductor package with heat sink | Chien-Ping Huang, Cheng-Hsu Hsiao | 2005-01-18 |
| 6707167 | Semiconductor package with crack-preventing member | Chien-Ping Huang | 2004-03-16 |
| 6703691 | Quad flat non-leaded semiconductor package and method of fabricating the same | Nan-Jang Chen, Kevin Chiang, Chien-Ping Huang | 2004-03-09 |
| 6699731 | Substrate of semiconductor package | Chien-Ping Huang, Chen-Hsu Hsiao | 2004-03-02 |
| 6657296 | Semicondctor package | Chien-Ping Huang | 2003-12-02 |
| 6650006 | Semiconductor package with stacked chips | Chien-Ping Huang, Cheng-Hsu Hsiao | 2003-11-18 |
| 6611434 | Stacked multi-chip package structure with on-chip integration of passive component | Randy H. Y. Lo, Chi-Chuan Wu | 2003-08-26 |
| 6541870 | Semiconductor package with stacked chips | Chien-Ping Huang, Cheng-Hsu Hsiao | 2003-04-01 |
| 6507104 | Semiconductor package with embedded heat-dissipating device | Chien-Ping Huang | 2003-01-14 |
| 6483039 | Substrate of semiconductor package | Chien-Ping Huang, Chen-Hsu Hsiao | 2002-11-19 |
| 6479894 | Layout method for thin and fine ball grid array package substrate with plating bus | Chien-Ping Huang | 2002-11-12 |
| 6469897 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same | Chien-Ping Huang, Han-Ping Pu | 2002-10-22 |
| 6458626 | Fabricating method for semiconductor package | Chien-Ping Huang, Cheng-Hsu Hsiao | 2002-10-01 |
| 6451625 | Method of fabricating a flip-chip ball-grid-array package with molded underfill | Han-Ping Pu | 2002-09-17 |
| 6449169 | Ball grid array package with interdigitated power ring and ground ring | Chih-Chin Liao, Chien-Te Chen | 2002-09-10 |
| 6444498 | Method of making semiconductor package with heat spreader | Chien-Ping Huang, Cheng-Hsu Hsiao | 2002-09-03 |
| 6443351 | Method of achieving solder ball coplanarity on ball grid array integrated circuit package | Chien-Ping Huang | 2002-09-03 |
| 6440779 | Semiconductor package based on window pad type of leadframe and method of fabricating the same | Fly Chiu, Audi Chen | 2002-08-27 |
| 6380059 | Method of breaking electrically conductive traces on substrate into open-circuited state | Chien-Ping Huang, Chiao-Yi Lee | 2002-04-30 |
| 6369455 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Chien-Ping Huang, Jeng-Yuan Lai | 2002-04-09 |
| 6359341 | Ball grid array integrated circuit package structure | Chien-Ping Huang, Kevin Chiang | 2002-03-19 |