Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6319750 | Layout method for thin and fine ball grid array package substrate with plating bus | Chien-Ping Huang | 2001-11-20 |
| 6306682 | Method of fabricating a ball grid array integrated circuit package having an encapsulating body | Chien-Ping Huang, Randy H. Y. Lo, Eric Ko, Jui-Meng Jao | 2001-10-23 |
| 6282094 | Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same | Randy H. Y. Lo, Jeng-Yuan Lai, Eric Ko | 2001-08-28 |