Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8207620 | Flip-chip semiconductor package and chip carrier for preventing corner delamination | Yuan-Lin Tzeng, Jeng-Yuan Lai, Yu-Po Wang, Cheng-Hsu Hsiao | 2012-06-26 |
| 6819565 | Cavity-down ball grid array semiconductor package with heat spreader | Yu-Po Wang, Wen-Jung Chiang | 2004-11-16 |