Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6716676 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Cheng-Yuan Lai | 2004-04-06 |
| 6472741 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Cheng-Yuan Lai | 2002-10-29 |
| 6400014 | Semiconductor package with a heat sink | Chien-Ping Huang, Cheng-Yuan Lai, Chih-Ming Huang | 2002-06-04 |