Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10646974 | Indexing device | — | 2020-05-12 |
| 9269645 | Fan-out wafer level package | Chu-Fu Lin, Chien-Li Kuo | 2016-02-23 |
| D690055 | Cosmetic case | — | 2013-09-17 |
| D687602 | Cosmetic case | — | 2013-08-06 |
| D660518 | Cosmetic case | — | 2012-05-22 |
| D641933 | Cosmetic case | — | 2011-07-19 |
| D631606 | Cosmetic case | — | 2011-01-25 |
| D631202 | Cosmetic case | — | 2011-01-18 |
| D630380 | Cosmetic case | — | 2011-01-04 |
| D630379 | Cosmetic case | — | 2011-01-04 |
| 7534653 | Chip packaging process | Min-Chih Hsuan, Kai-Kuang Ho, Kuang-Hui Tang | 2009-05-19 |
| 7399695 | Integrated die bumping process | Kai-Kuang Ho | 2008-07-15 |
| 7285739 | Waterproof structure for switch pins | — | 2007-10-23 |
| 7268440 | Fabrication of semiconductor integrated circuit chips | Zong-Huei Lin, Hung-Min Liu, Jui-Meng Jao, Wen-Tung Chang, Kai-Kuang Ho | 2007-09-11 |
| 7241678 | Integrated die bumping process | Kai-Kuang Ho | 2007-07-10 |
| 7211500 | Pre-process before cutting a wafer and method of cutting a wafer | Kun-Chih Wang, Hermen Liu, Paul Chen, Kai-Kuang Ho | 2007-05-01 |
| 7026234 | Parasitic capacitance-preventing dummy solder bump structure and method of making the same | Jui-Meng Jao, Shing-Ren Sheu, Hung-Min Liu, Kun-Chih Wang | 2006-04-11 |
| 6940176 | Solder pads for improving reliability of a package | — | 2005-09-06 |
| 6881654 | Solder bump structure and laser repair process for memory device | Hung-Min Liu | 2005-04-19 |
| 5664658 | Switch assembly for a coin collector | Jenny Luo | 1997-09-09 |