| 7211500 |
Pre-process before cutting a wafer and method of cutting a wafer |
Kuo-Ming Chen, Kun-Chih Wang, Paul Chen, Kai-Kuang Ho |
2007-05-01 |
| 7170167 |
Method for manufacturing wafer level chip scale package structure |
Min-Chih Hsuan, Paul Chen, Kun-Chih Wang, Kai-Kuang Ho |
2007-01-30 |
| 6794606 |
Laser repair operation |
— |
2004-09-21 |
| 6667195 |
Laser repair operation |
— |
2003-12-23 |
| 6664142 |
Laser repair operation |
— |
2003-12-16 |
| 6455943 |
Bonding pad structure of semiconductor device having improved bondability |
Shing-Ren Sheu |
2002-09-24 |
| 6424025 |
Cross grid array package structure and method of manufacture |
— |
2002-07-23 |
| 6388326 |
Bonding pad on a semiconductor chip |
Yimin Huang |
2002-05-14 |
| 6372621 |
Method of forming a bonding pad on a semiconductor chip |
Yimin Huang |
2002-04-16 |
| 6316727 |
Multi-chip semiconductor package |
— |
2001-11-13 |
| 6297561 |
Semiconductor chip |
Yimin Huang |
2001-10-02 |
| 6251694 |
Method of testing and packaging a semiconductor chip |
Yimin Huang |
2001-06-26 |
| 6228689 |
Trench style bump and application of the same |
— |
2001-05-08 |
| 6190938 |
Cross grid array package structure and method of manufacture |
— |
2001-02-20 |
| 6121063 |
Method of testing a ball grid array IC |
Gino J. F. Shian |
2000-09-19 |