Hermen Liu has been granted 15 US patents while listed as an inventor at United Microelectronics . The first was granted in 2000 and the most recent in May 2007. Hermen Liu ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Hermen Liu in Daxi District, TW.
Patents per Year Patents granted per year, 2000 to 2007 Bar chart with a peak of 5 patents in 2001. peak 5 2000: 1 patents 2000 2001: 5 patents 2001 2002: 4 patents 2002 2003: 2 patents 2003 2004: 1 patents 2004 2007: 2 patents 2007
Issued Patents All Time
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Showing 1–15 of 15 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
7211500 Pre-process before cutting a wafer and method of cutting a wafer Kuo-Ming Chen , Kun-Chih Wang , Paul Chen , Kai-Kuang Ho 2007-05-01
$2,487,000
7170167 Method for manufacturing wafer level chip scale package structure Min-Chih Hsuan , Paul Chen , Kun-Chih Wang , Kai-Kuang Ho 2007-01-30
$1,895,000
6794606 Laser repair operation — 2004-09-21
$918,000
6667195 Laser repair operation — 2003-12-23
$2,451,000
6664142 Laser repair operation — 2003-12-16
$1,037,000
6455943 Bonding pad structure of semiconductor device having improved bondability Shing-Ren Sheu 2002-09-24
$1,063,000
6424025 Cross grid array package structure and method of manufacture — 2002-07-23
$1,466,000
6388326 Bonding pad on a semiconductor chip Yimin Huang 2002-05-14
$2,736,000
6372621 Method of forming a bonding pad on a semiconductor chip Yimin Huang 2002-04-16
$1,757,000
6316727 Multi-chip semiconductor package — 2001-11-13
$597,000
6297561 Semiconductor chip Yimin Huang 2001-10-02
$470,000
6251694 Method of testing and packaging a semiconductor chip Yimin Huang 2001-06-26
$902,000
6228689 Trench style bump and application of the same — 2001-05-08
$978,000
6190938 Cross grid array package structure and method of manufacture — 2001-02-20
$1,683,000
6121063 Method of testing a ball grid array IC Gino J. F. Shian 2000-09-19