Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211500 | Pre-process before cutting a wafer and method of cutting a wafer | Kuo-Ming Chen, Kun-Chih Wang, Paul Chen, Kai-Kuang Ho | 2007-05-01 |
| 7170167 | Method for manufacturing wafer level chip scale package structure | Min-Chih Hsuan, Paul Chen, Kun-Chih Wang, Kai-Kuang Ho | 2007-01-30 |
| 6794606 | Laser repair operation | — | 2004-09-21 |
| 6667195 | Laser repair operation | — | 2003-12-23 |
| 6664142 | Laser repair operation | — | 2003-12-16 |
| 6455943 | Bonding pad structure of semiconductor device having improved bondability | Shing-Ren Sheu | 2002-09-24 |
| 6424025 | Cross grid array package structure and method of manufacture | — | 2002-07-23 |
| 6388326 | Bonding pad on a semiconductor chip | Yimin Huang | 2002-05-14 |
| 6372621 | Method of forming a bonding pad on a semiconductor chip | Yimin Huang | 2002-04-16 |
| 6316727 | Multi-chip semiconductor package | — | 2001-11-13 |
| 6297561 | Semiconductor chip | Yimin Huang | 2001-10-02 |
| 6251694 | Method of testing and packaging a semiconductor chip | Yimin Huang | 2001-06-26 |
| 6228689 | Trench style bump and application of the same | — | 2001-05-08 |
| 6190938 | Cross grid array package structure and method of manufacture | — | 2001-02-20 |
| 6121063 | Method of testing a ball grid array IC | Gino J. F. Shian | 2000-09-19 |