Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12169164 | Diffusive gradients in thin films (DGT) test device for lake water and test method using same | Shuhang Wang, Zhihao Wu, Xia Jiang, Bo Zhang, Wenwen Wang +4 more | 2024-12-17 |
| 11714450 | Stylus holders | Andrew Shane Elsey, Derek Kyle Joseph Kanas | 2023-08-01 |
| 11579049 | Diffusive gradients in thin films (DGT) probe test device for sediment core in lake and test method using the same | Zhihao Wu, Shuhang Wang, Xia Jiang, Bo Zhang, Wenwen Wang +4 more | 2023-02-14 |
| 11581859 | Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations | Alexander Komposch, Qianli Mu, Eng Wah Woo | 2023-02-14 |
| 11424092 | Rolling elements-based pivoting supports for keyboards | Chih-Chen Hung, Hung-Ming Chen, Ke-Jian Liou | 2022-08-23 |
| 10826314 | Wireless chargers | Kuan-Ting Wu, Chienlung Yang | 2020-11-03 |
| 10513003 | Precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereof | Siying Ling, Baodi Yu, Xiaodong Wang, Liding Wang | 2019-12-24 |
| 10234905 | Hinge for foldable components | Wei-Chung Chen, Wei-Kuang Chu, Chi-Hao Chang, Kuan-Ting Wu, Cheng-Feng Liao +1 more | 2019-03-19 |
| 10002720 | Preparation of metal oxide-graphene composite films | Chongjun Zhao, Xiangmao DONG, Shudi Min, Zhuomin Zhang, Jianbo Dong +2 more | 2018-06-19 |
| 7562539 | Method and the device for making high precision coating of insert for glass molding | — | 2009-07-21 |
| 7372168 | Semiconductor chip capable of implementing wire bonding over active circuits | Bing Wu, Mei-Ling Chao, Shiao-Shien Chen | 2008-05-13 |
| 7304385 | Semiconductor chip capable of implementing wire bonding over active circuits | Bing Wu | 2007-12-04 |
| 7211500 | Pre-process before cutting a wafer and method of cutting a wafer | Kuo-Ming Chen, Hermen Liu, Paul Chen, Kai-Kuang Ho | 2007-05-01 |
| 7208837 | Semiconductor chip capable of implementing wire bonding over active circuits | Bing Wu | 2007-04-24 |
| 7170167 | Method for manufacturing wafer level chip scale package structure | Min-Chih Hsuan, Paul Chen, Hermen Liu, Kai-Kuang Ho | 2007-01-30 |
| 7147454 | Optical lens molding apparatus and precision molding apparatus | — | 2006-12-12 |
| 7071575 | Semiconductor chip capable of implementing wire bonding over active circuits | Bing Wu, Mei-Ling Chao, Shiao-Shien Chen | 2006-07-04 |
| 7026234 | Parasitic capacitance-preventing dummy solder bump structure and method of making the same | Jui-Meng Jao, Shing-Ren Sheu, Kuo-Ming Chen, Hung-Min Liu | 2006-04-11 |
| 6900541 | Semiconductor chip capable of implementing wire bonding over active circuits | Bing Wu | 2005-05-31 |
| 6710448 | Bonding pad structure | — | 2004-03-23 |
| 6707129 | Fuse structure integrated wire bonding on the low k interconnect and method for making the same | — | 2004-03-16 |
| 6371045 | Physical vapor deposition device for forming a metallic layer on a semiconductor wafer | Chao-Ching Hsieh | 2002-04-16 |
| 6348398 | Method of forming pad openings and fuse openings | — | 2002-02-19 |
| 6339025 | Method of fabricating a copper capping layer | Chih-Chien Liu, Wen-Yi Hsieh, Yimin Huang | 2002-01-15 |
| 6249073 | Device including a micromechanical resonator having an operating frequency and method of extending same | Clark T.-C. Nguyen, Michael Shannon McCorquodale | 2001-06-19 |