| 12486671 |
Wooden newel with a clean surface and preparation method thereof |
— |
2025-12-02 |
|
| 12169164 |
Diffusive gradients in thin films (DGT) test device for lake water and test method using same |
Shuhang Wang, Zhihao Wu, Xia Jiang, Bo Zhang, Wenwen Wang +4 more |
2024-12-17 |
|
| 11714450 |
Stylus holders |
Andrew Shane Elsey, Derek Kyle Joseph Kanas |
2023-08-01 |
$9,524,000 |
| 11581859 |
Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations |
Alexander Komposch, Qianli Mu, Eng Wah Woo |
2023-02-14 |
$76,953,000 |
| 11579049 |
Diffusive gradients in thin films (DGT) probe test device for sediment core in lake and test method using the same |
Zhihao Wu, Shuhang Wang, Xia Jiang, Bo Zhang, Wenwen Wang +4 more |
2023-02-14 |
|
| 11424092 |
Rolling elements-based pivoting supports for keyboards |
Chih-Chen Hung, Hung-Ming Chen, Ke-Jian Liou |
2022-08-23 |
$7,171,000 |
| 10826314 |
Wireless chargers |
Kuan-Ting Wu, Chienlung Yang |
2020-11-03 |
|
| 10513003 |
Precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereof |
Siying Ling, Baodi Yu, Xiaodong Wang, Liding Wang |
2019-12-24 |
|
| 10234905 |
Hinge for foldable components |
Wei-Chung Chen, Wei-Kuang Chu, Chi-Hao Chang, Kuan-Ting Wu, Cheng-Feng Liao +1 more |
2019-03-19 |
$5,117,000 |
| 10002720 |
Preparation of metal oxide-graphene composite films |
Chongjun Zhao, Xiangmao DONG, Shudi Min, Zhuomin Zhang, Jianbo Dong +2 more |
2018-06-19 |
|
| 7562539 |
Method and the device for making high precision coating of insert for glass molding |
— |
2009-07-21 |
|
| 7372168 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Bing Wu, Mei-Ling Chao, Shiao-Shien Chen |
2008-05-13 |
$2,386,000 |
| 7304385 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Bing Wu |
2007-12-04 |
$2,179,000 |
| 7211500 |
Pre-process before cutting a wafer and method of cutting a wafer |
Kuo-Ming Chen, Hermen Liu, Paul Chen, Kai-Kuang Ho |
2007-05-01 |
$2,487,000 |
| 7208837 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Bing Wu |
2007-04-24 |
$7,645,000 |
| 7170167 |
Method for manufacturing wafer level chip scale package structure |
Min-Chih Hsuan, Paul Chen, Hermen Liu, Kai-Kuang Ho |
2007-01-30 |
$1,895,000 |
| 7147454 |
Optical lens molding apparatus and precision molding apparatus |
— |
2006-12-12 |
|
| 7071575 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Bing Wu, Mei-Ling Chao, Shiao-Shien Chen |
2006-07-04 |
|
| 7026234 |
Parasitic capacitance-preventing dummy solder bump structure and method of making the same |
Jui-Meng Jao, Shing-Ren Sheu, Kuo-Ming Chen, Hung-Min Liu |
2006-04-11 |
$2,268,000 |
| 6900541 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Bing Wu |
2005-05-31 |
$2,302,000 |
| 6710448 |
Bonding pad structure |
— |
2004-03-23 |
$2,485,000 |
| 6707129 |
Fuse structure integrated wire bonding on the low k interconnect and method for making the same |
— |
2004-03-16 |
$1,749,000 |
| 6371045 |
Physical vapor deposition device for forming a metallic layer on a semiconductor wafer |
Chao-Ching Hsieh |
2002-04-16 |
$1,757,000 |
| 6348398 |
Method of forming pad openings and fuse openings |
— |
2002-02-19 |
$2,915,000 |
| 6339025 |
Method of fabricating a copper capping layer |
Chih-Chien Liu, Wen-Yi Hsieh, Yimin Huang |
2002-01-15 |
$7,000,000 |
