| 12482777 |
Copper pillar bump structure and method of manufacturing the same |
Cheng-Pang Wang |
2025-11-25 |
|
| 12417985 |
Semiconductor device and method for fabricating the same |
Meng-Ting Chiang, Jen-Hsien CHANG |
2025-09-16 |
|
| 12387998 |
QFN package and fabricating method of the same |
Chiu-Feng Lee, Chen-Hsiao Wang |
2025-08-12 |
|
| 11848660 |
Surface acoustic wave device fabrication method |
Chen-Hsiao Wang |
2023-12-19 |
$1,222,000 |
| 11495510 |
Semiconductor device package structure and method for fabricating the same |
Yu-Yuan Huang, Tsung-Kai Yu, Chen-Hsiao Wang, Kuang-Hui Tang |
2022-11-08 |
$1,363,000 |
| 9502366 |
Semiconductor structure with UBM layer and method of fabricating the same |
Chen-Hsiao Wang, Yi-Feng Hsu |
2016-11-22 |
$102,000 |
| 7696606 |
Metal structure |
Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Ching-Li Yang |
2010-04-13 |
$2,690,000 |
| 7649268 |
Semiconductor wafer |
Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Ching-Li Yang |
2010-01-19 |
$2,673,000 |
| 7534653 |
Chip packaging process |
Min-Chih Hsuan, Kuo-Ming Chen, Kuang-Hui Tang |
2009-05-19 |
$7,505,000 |
| 7399695 |
Integrated die bumping process |
Kuo-Ming Chen |
2008-07-15 |
$6,406,000 |
| 7387950 |
Method for forming a metal structure |
Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Ching-Li Yang |
2008-06-17 |
$1,665,000 |
| 7268440 |
Fabrication of semiconductor integrated circuit chips |
Zong-Huei Lin, Hung-Min Liu, Jui-Meng Jao, Wen-Tung Chang, Kuo-Ming Chen |
2007-09-11 |
$2,364,000 |
| 7241678 |
Integrated die bumping process |
Kuo-Ming Chen |
2007-07-10 |
$7,901,000 |
| 7211500 |
Pre-process before cutting a wafer and method of cutting a wafer |
Kuo-Ming Chen, Kun-Chih Wang, Hermen Liu, Paul Chen |
2007-05-01 |
$2,487,000 |
| 7170167 |
Method for manufacturing wafer level chip scale package structure |
Min-Chih Hsuan, Paul Chen, Hermen Liu, Kun-Chih Wang |
2007-01-30 |
$1,895,000 |
| 6965517 |
Component substrate for a printed circuit board and method of assembyling the substrate and the circuit board |
John Wanes, David L Gauthier, Albert J. Kerklaan |
2005-11-15 |
|
| 6846697 |
Integrated circuit packages and the method for making the same |
Te-Sheng Yang, Charlie Han |
2005-01-25 |
$1,485,000 |
| 6545350 |
Integrated circuit packages and the method for the same |
Te-Sheng Yang, Charlie Han |
2003-04-08 |
$1,034,000 |
| 6429532 |
Pad design |
Charlie Han |
2002-08-06 |
$801,000 |
| 6204562 |
Wafer-level chip scale package |
Te-Sheng Yang |
2001-03-20 |
$1,354,000 |
| 6043109 |
Method of fabricating wafer-level package |
Te-Sheng Yang |
2000-03-28 |
|
| 5446345 |
Miniature portable flasher light |
Wade Halabi |
1995-08-29 |
|