Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723421 | System and method for absorbing moisture within a face mask | Kevin Lu, Robin XIANG, Jerry Shen | 2023-08-15 |
| 6846697 | Integrated circuit packages and the method for making the same | Kai-Kuang Ho, Te-Sheng Yang | 2005-01-25 |
| D501178 | Triple engine jet fighter double seater design | — | 2005-01-25 |
| D499689 | Triple engine jet fighter single seater | — | 2004-12-14 |
| 6820029 | Method for determining failure rate and selecting best burn-in time | Walx Fang | 2004-11-16 |
| 6669520 | Method of fabricating an LC panel | Chin-Lung Hung, Wei-Hsiao Chen | 2003-12-30 |
| 6545350 | Integrated circuit packages and the method for the same | Kai-Kuang Ho, Te-Sheng Yang | 2003-04-08 |
| 6512708 | Placement and routing for wafer scale memory | Min-Chih Hsuan, Tazsheng Feng, Cheng-Ju Hsieh | 2003-01-28 |
| D467533 | Long distance long range supersonic jet fighter | — | 2002-12-24 |
| 6461956 | Method of forming package | Min-Chih Hsuan | 2002-10-08 |
| 6429532 | Pad design | Kai-Kuang Ho | 2002-08-06 |
| 6399421 | Dual-dies packaging structure and packaging method | Te-Sheng Yang | 2002-06-04 |
| 6388460 | Alternate timing wafer burn-in method | Walx Fang | 2002-05-14 |
| 6352923 | Method of fabricating direct contact through hole type | Min-Chih Hsuan | 2002-03-05 |
| 6323546 | Direct contact through hole type wafer structure | Min-Chih Hsuan | 2001-11-27 |
| 6313527 | Dual-dies packaging structure and packaging method | Te-Sheng Yang | 2001-11-06 |
| 6279141 | Preburn-in dynamic random access memory module and preburn-in circuit board thereof | Min-Chih Hsuan, Jerry Jaw, Tung Chi Liu | 2001-08-21 |
| 6252300 | Direct contact through hole type wafer structure | Min-Chih Hsuan | 2001-06-26 |
| 6214630 | Wafer level integrated circuit structure and method of manufacturing the same | Min-Chih Hsuan, Taisheng Feng | 2001-04-10 |
| 6166444 | Cascade-type chip module | Min-Chih Hsuan | 2000-12-26 |
| 6133629 | Multi-chip module package | Ming-Huang Hung | 2000-10-17 |
| 5995428 | Circuit for burn-in operation on a wafer of memory devices | Pien Chien, Shih-Chin Lin | 1999-11-30 |
| 5946248 | Method for burn-in operation on a wafer of memory devices | Pien Chien, Shih-Chin Lin | 1999-08-31 |
| 5875136 | Repairable memory module and method of repairing memory modules | Min-Chih Hsuan, Jerry Jaw | 1999-02-23 |