Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6846697 | Integrated circuit packages and the method for making the same | Kai-Kuang Ho, Charlie Han | 2005-01-25 |
| 6545350 | Integrated circuit packages and the method for the same | Kai-Kuang Ho, Charlie Han | 2003-04-08 |
| 6399421 | Dual-dies packaging structure and packaging method | Charlie Han | 2002-06-04 |
| 6313527 | Dual-dies packaging structure and packaging method | Charlie Han | 2001-11-06 |
| 6291881 | Dual silicon chip package | — | 2001-09-18 |
| 6204562 | Wafer-level chip scale package | Kai-Kuang Ho | 2001-03-20 |
| 6043109 | Method of fabricating wafer-level package | Kai-Kuang Ho | 2000-03-28 |