Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10292546 | Urinal cartridge and urinal having the same | Kelvin Yi-Tse Lai | 2019-05-21 |
| 10165693 | Attachment device for micro devices and wearable micro devices having the attachment device | Yu-Han Huang | 2018-12-25 |
| 8976018 | Local detection processing device and system | — | 2015-03-10 |
| 8786427 | Portable information detection and processing device and system | — | 2014-07-22 |
| 8546739 | Manufacturing method of wafer level chip scale package of image-sensing module | Tsung-Hsi Ko, Li-Che Chen | 2013-10-01 |
| 7659501 | Image-sensing module of image capture apparatus and manufacturing method thereof | Tsung-Hsi Ko, Li-Che Chen | 2010-02-09 |
| 7534653 | Chip packaging process | Kai-Kuang Ho, Kuo-Ming Chen, Kuang-Hui Tang | 2009-05-19 |
| 7450150 | Integrated audio/video sensor | — | 2008-11-11 |
| 7192847 | Ultra-thin wafer level stack packaging method | — | 2007-03-20 |
| 7179740 | Integrated circuit with improved interconnect structure and process for making same | — | 2007-02-20 |
| 7170167 | Method for manufacturing wafer level chip scale package structure | Paul Chen, Hermen Liu, Kun-Chih Wang, Kai-Kuang Ho | 2007-01-30 |
| 7141875 | Flexible multi-chip module and method of making the same | Chi Shen Ho, Chang-Ming Lin, Kuolung Lei | 2006-11-28 |
| 7030466 | Intermediate structure for making integrated circuit device and wafer | — | 2006-04-18 |
| 6838310 | Integrated circuit with improved interconnect structure and process for making same | — | 2005-01-04 |
| 6512708 | Placement and routing for wafer scale memory | Tazsheng Feng, Charlie Han, Cheng-Ju Hsieh | 2003-01-28 |
| 6461956 | Method of forming package | Charlie Han | 2002-10-08 |
| 6429509 | Integrated circuit with improved interconnect structure and process for making same | — | 2002-08-06 |
| 6352923 | Method of fabricating direct contact through hole type | Charlie Han | 2002-03-05 |
| 6323546 | Direct contact through hole type wafer structure | Charlie Han | 2001-11-27 |
| 6279141 | Preburn-in dynamic random access memory module and preburn-in circuit board thereof | Charlie Han, Jerry Jaw, Tung Chi Liu | 2001-08-21 |
| 6268642 | Wafer level package | Cheng-Te Lin | 2001-07-31 |
| 6252300 | Direct contact through hole type wafer structure | Charlie Han | 2001-06-26 |
| 6239366 | Face-to-face multi-chip package | Cheng-Te Lin | 2001-05-29 |
| 6239367 | Multi-chip chip scale package | Cheng-Te Lin | 2001-05-29 |
| 6236109 | Multi-chip chip scale package | Cheng-Te Lin | 2001-05-22 |