Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7208344 | Wafer level mounting frame for ball grid array packaging, and method of making and using the same | — | 2007-04-24 |
| 7141875 | Flexible multi-chip module and method of making the same | Min-Chih Hsuan, Chang-Ming Lin, Kuolung Lei | 2006-11-28 |
| 7078272 | Wafer scale integration packaging and method of making and using the same | Chang-Ming Lin | 2006-07-18 |