Kuolung Lei has been granted 11 US patents while listed as an inventor at Integrated Device Technology . The first was granted in 2004 and the most recent in April 2022. Kuolung Lei ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Kuolung Lei in San Jose, CA, US.
Patents per Year Patents granted per year, 2004 to 2022 Bar chart with a peak of 2 patents in 2011. peak 2 2004: 1 patents 2004 2006: 1 patents 2006 2010: 1 patents 2010 2011: 2 patents 2011 2013: 1 patents 2013 2017: 1 patents 2017 2018: 1 patents 2018 2019: 1 patents 2019 2020: 1 patents 2020 2022: 1 patents 2022
Issued Patents All Time
Showing 1–11 of 11 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
11305984
Water proofing and water detection schemes for MEMS-based environmental sensing devices
Krishna Prasad Vummidi Murali , Richard Yeh , Yun X. Ma
2022-04-19
$219,368,000
10640367
Water proofing and water detection schemes for MEMS-based environmental sensing devices
Krishna Prasad Vummidi Murali , Richard Yeh , Yun X. Ma
2020-05-05
$109,977,000
10436647
Non-contact temperature measurement sensor
Jerome Chandra Bhat , Craig A. Easson , Arvin Emadi , Judy Hermann
2019-10-08
$27,106,000
10113915
Non-contact temperature measurement sensor
Jerome Chandra Bhat , Craig A. Easson , Arvin Emadi , Judy Hermann
2018-10-30
$90,096,000
9738511
Reduction of chipping damage to MEMS structure
Jongwoo Shin , Kirt Williams , Cerina Zhang
2017-08-22
8426233
Methods of packaging microelectromechanical resonators
Minfan Pai , Wanling Pan
2013-04-23
$2,443,000
7955885
Methods of forming packaged micro-electromechanical devices
Harmeet Bhugra , Ye Wang
2011-06-07
$4,310,000
7871857
Methods of forming multi-chip semiconductor substrates
Harmeet Bhugra
2011-01-18
$6,571,000
7842613
Methods of forming microelectronic packaging substrates having through-substrate vias therein
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2010-11-30
$3,914,000
7141875
Flexible multi-chip module and method of making the same
Min-Chih Hsuan , Chi Shen Ho , Chang-Ming Lin
2006-11-28
6784089
Flat-top bumping structure and preparation method
Tony Shen , Susana Samoranos , Te-Sung Wu , Tsing-Chow Wang
2004-08-31