Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
KL

Kuolung Lei — 11 Patents

ITIntegrated Device Technology: 4 patents #156 of 758Top 25%
APAptos: 2 patents #4 of 16Top 25%
MPMaxim Integrated Products: 2 patents #368 of 945Top 40%
Apple: 2 patents #9,294 of 18,612Top 50%
INInvensense: 1 patents #258 of 391Top 70%
San Jose, CA: #5,902 of 32,062 inventorsTop 20%
California: #56,011 of 386,348 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Kuolung Lei has been granted 11 US patents while listed as an inventor at Integrated Device Technology. The first was granted in 2004 and the most recent in April 2022. Kuolung Lei ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Kuolung Lei in San Jose, CA, US.

Patents per Year

Patents granted per year, 2004 to 2022Bar chart with a peak of 2 patents in 2011.peak 22004: 1 patents20042006: 1 patents20062010: 1 patents20102011: 2 patents20112013: 1 patents20132017: 1 patents20172018: 1 patents20182019: 1 patents20192020: 1 patents20202022: 1 patents2022

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11305984 Water proofing and water detection schemes for MEMS-based environmental sensing devices Krishna Prasad Vummidi Murali, Richard Yeh, Yun X. Ma 2022-04-19 $219,368,000
10640367 Water proofing and water detection schemes for MEMS-based environmental sensing devices Krishna Prasad Vummidi Murali, Richard Yeh, Yun X. Ma 2020-05-05 $109,977,000
10436647 Non-contact temperature measurement sensor Jerome Chandra Bhat, Craig A. Easson, Arvin Emadi, Judy Hermann 2019-10-08 $27,106,000
10113915 Non-contact temperature measurement sensor Jerome Chandra Bhat, Craig A. Easson, Arvin Emadi, Judy Hermann 2018-10-30 $90,096,000
9738511 Reduction of chipping damage to MEMS structure Jongwoo Shin, Kirt Williams, Cerina Zhang 2017-08-22
8426233 Methods of packaging microelectromechanical resonators Minfan Pai, Wanling Pan 2013-04-23 $2,443,000
7955885 Methods of forming packaged micro-electromechanical devices Harmeet Bhugra, Ye Wang 2011-06-07 $4,310,000
7871857 Methods of forming multi-chip semiconductor substrates Harmeet Bhugra 2011-01-18 $6,571,000
7842613 Methods of forming microelectronic packaging substrates having through-substrate vias therein 2010-11-30 $3,914,000
7141875 Flexible multi-chip module and method of making the same Min-Chih Hsuan, Chi Shen Ho, Chang-Ming Lin 2006-11-28
6784089 Flat-top bumping structure and preparation method Tony Shen, Susana Samoranos, Te-Sung Wu, Tsing-Chow Wang 2004-08-31