Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492242 | Dry flux bonding device and method | Owen R. Fay, Xiao Li, Josh D. Woodland, Shijian Luo, Jaspreet S. Gandhi | 2013-07-23 |
| 6784089 | Flat-top bumping structure and preparation method | Kuolung Lei, Tony Shen, Susana Samoranos, Tsing-Chow Wang | 2004-08-31 |
| 6524645 | Process for the electroless deposition of metal on a substrate | Michael D. Evans, Tae-Yong Kim, Henry Law | 2003-02-25 |
| 6448171 | Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability | Tsing-Chow Wang | 2002-09-10 |
| 6362087 | Method for fabricating a microelectronic fabrication having formed therein a redistribution structure | Tsing-Chow Wang, Erh-Kong Chieh | 2002-03-26 |
| 5779873 | Electroplating of nickel on nickel ferrite devices | Henry Law, Lynn F. Schneemeyer | 1998-07-14 |
| 5619791 | Method for fabricating highly conductive vias | Vincent George Lambrecht, Jr., Henry Law, Apurba Roy, John Thomson, Jr. | 1997-04-15 |
| 5618611 | Metallization of ferrites through surface reduction | Sungho Jin, Henry Law, Thomas H. Tiefel | 1997-04-08 |