Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8575954 | Structures and processes for fabrication of probe card assemblies with multi-layer interconnect | Fu Chiung Chong, William R. Bottoms, Nim C. Lam | 2013-11-05 |
| 7137830 | Miniaturized contact spring | Syamal Kumar Lahiri, Frank Swiatowiec, Fu Chiung Chong, Sammy Mok, Roman Milter +4 more | 2006-11-21 |
| 7126220 | Miniaturized contact spring | Syamal Kumar Lahiri, Frank Swiatowiec, Fu Chiung Chong, Sammy Mok, Roman Milter +4 more | 2006-10-24 |
| 6362087 | Method for fabricating a microelectronic fabrication having formed therein a redistribution structure | Tsing-Chow Wang, Te-Sung Wu | 2002-03-26 |