Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8531202 | Probe card test apparatus and method | Frank Swiatowiec, Fariborz Agahdel | 2013-09-10 |
| 7952373 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Fu Chiung Chong | 2011-05-31 |
| 7884634 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-02-08 |
| 7876087 | Probe card repair using coupons with spring contacts and separate atachment points | Frank Swiatowiec, Fariborz Agahdel | 2011-01-25 |
| 7872482 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-01-18 |
| 7812626 | High density interconnect system for IC packages and interconnect assemblies | Wilmer R. Bottoms, Fu Chiung Chong, Douglas N. Modlin | 2010-10-12 |
| 7772860 | Massively parallel interface for electronic circuit | Fu Chiung Chong | 2010-08-10 |
| 7621761 | Systems for testing and packaging integrated circuits | Fu Chiung Chong, Roman Milter | 2009-11-24 |
| 7579848 | High density interconnect system for IC packages and interconnect assemblies | Wilmer R. Bottoms, Fu Chiung Chong, Douglas N. Modlin | 2009-08-25 |
| 7403029 | Massively parallel interface for electronic circuit | Fu Chiung Chong | 2008-07-22 |
| 7382142 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2008-06-03 |
| 7247035 | Enhanced stress metal spring contactor | Fu Chiung Chong, Roman Milter | 2007-07-24 |
| 7138818 | Massively parallel interface for electronic circuit | Fu Chiung Chong | 2006-11-21 |
| 7137830 | Miniaturized contact spring | Syamal Kumar Lahiri, Frank Swiatowiec, Fu Chiung Chong, Erh-Kong Chieh, Roman Milter +4 more | 2006-11-21 |
| 7126220 | Miniaturized contact spring | Syamal Kumar Lahiri, Frank Swiatowiec, Fu Chiung Chong, Erh-Kong Chieh, Roman Milter +4 more | 2006-10-24 |
| 7126358 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Fu Chiung Chong | 2006-10-24 |
| 7009412 | Massively parallel interface for electronic circuit | Fu Chiung Chong | 2006-03-07 |
| 6917525 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs | Fu Chiung Chong, Frank Swiatowiec, Syamal Kumar Lahiri, Joseph Haemer | 2005-07-12 |
| 6815961 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Fu Chiung Chong | 2004-11-09 |
| 6812718 | Massively parallel interface for electronic circuits | Fu Chiung Chong | 2004-11-02 |
| 6799976 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Fu Chiung Chong | 2004-10-05 |
| 6791171 | Systems for testing and packaging integrated circuits | Fu Chiung Chong | 2004-09-14 |
| 6710609 | Mosaic decal probe | Fu Chiung Chong, Ira Feldman | 2004-03-23 |
| 5729433 | Multiple chip module assembly for top of mother board | — | 1998-03-17 |
| 5703753 | Mounting assembly for multiple chip module with more than one substrate and computer using same | — | 1997-12-30 |