Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884634 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Douglas N. Modlin, Sammy Mok +3 more | 2011-02-08 |
| 7872482 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Douglas N. Modlin, Sammy Mok +3 more | 2011-01-18 |
| 7382142 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Douglas N. Modlin, Sammy Mok +3 more | 2008-06-03 |
| 6242279 | High density wire bond BGA | Chung W. Ho | 2001-06-05 |