Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227824 | Chip carrier and manufacturing method thereof | — | 2022-01-18 |
| 11217551 | Chip package structure and manufacturing method thereof | — | 2022-01-04 |
| 11189501 | Chip package structure and manufacturing method thereof | — | 2021-11-30 |
| 11178774 | Method for manufacturing circuit board | — | 2021-11-16 |
| 10201099 | Manufacturing method of circuit substrate including electronic device | — | 2019-02-05 |
| 10076039 | Method of fabricating packaging substrate | Tzyy-Jang Tseng | 2018-09-11 |
| 9484223 | Coreless packaging substrate and method of fabricating the same | Tzyy-Jang Tseng | 2016-11-01 |
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Tzyy-Jang Tseng, Dyi-Chung Hu, Huan-Ling Lee, Sheng-Yuah He | 2016-11-01 |
| 9257379 | Coreless packaging substrate and method of fabricating the same | Tzyy-Jang Tseng | 2016-02-09 |
| 9137899 | Process of electronic structure and electronic structure | — | 2015-09-15 |
| 9070616 | Method of fabricating packaging substrate | Tzyy-Jang Tseng | 2015-06-30 |
| 8939188 | Edge separation equipment and operating method thereof | Chih-Hsien Cheng | 2015-01-27 |
| 8912642 | Packaging substrate and fabrication method thereof | Tzyy-Jang Tseng | 2014-12-16 |
| 8859912 | Coreless package substrate and fabrication method thereof | Tzyy-Jang Tseng | 2014-10-14 |
| 8624382 | Packaging substrate and method of fabricating the same | Tzyy-Jang Tseng | 2014-01-07 |
| 7867908 | Method of fabricating substrate | Tzyy-Jang Tseng, Chih-Ming Chang, Cheng-Po Yu | 2011-01-11 |
| 7642571 | Substrate core | Tzyy-Jang Tseng, Chih-Ming Chang, Cheng-Po Yu | 2010-01-05 |
| 7540969 | High thermal conducting circuit substrate and manufacturing process thereof | Leo Shen | 2009-06-02 |
| 7535098 | Structure of substrate | Tzyy-Jang Tseng, Chih-Ming Chang, Cheng-Po Yu | 2009-05-19 |
| 7223687 | Printed wiring board and method of fabricating the same | Shih-Lian Cheng, Leo Shen | 2007-05-29 |
| 6937044 | Bare die carrier | Fariborz Agahdel, Brad Griswold, Syed A. Husain, Robert Moti, William C. Robinette, Jr. | 2005-08-30 |
| 6753600 | Structure of a substrate for a high density semiconductor package | — | 2004-06-22 |
| 6586846 | Low cost decal material used for packaging | — | 2003-07-01 |
| 6562656 | Cavity down flip chip BGA | — | 2003-05-13 |
| 6455926 | High density cavity-up wire bond BGA | — | 2002-09-24 |