Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6424037 | Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball | Tsing-Chow Wang | 2002-07-23 |
| 6331447 | High density flip chip BGA | — | 2001-12-18 |
| 6320256 | Quick turn around fabrication process for packaging substrates and high density cards | — | 2001-11-20 |
| 6294477 | Low cost high density thin film processing | Ujwal Anant Deshpaude, Chang-Ming Lin | 2001-09-25 |
| 6291268 | Low cost method of testing a cavity-up BGA substrate | — | 2001-09-18 |
| 6287890 | Low cost decal material used for packaging | — | 2001-09-11 |
| 6281041 | Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball | Tsing-Chow Wang | 2001-08-28 |
| 6277672 | BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology | — | 2001-08-21 |
| 6242279 | High density wire bond BGA | Anna Litza | 2001-06-05 |
| 6221693 | High density flip chip BGA | — | 2001-04-24 |
| 6197614 | Quick turn around fabrication process for packaging substrates and high density cards | — | 2001-03-06 |
| 6049215 | Bare die carrier | Fariborz Agahdel, Brad Griswold, Syed A. Husain, Robert Moti, William C. Robinette, Jr. | 2000-04-11 |
| 5998859 | Packaging and interconnect system for integrated circuits | Bradley L. Griswold, William C. Robinette, Jr. | 1999-12-07 |
| 5796164 | Packaging and interconnect system for integrated circuits | Mark T. McGraw, Bradley L. Griswold, Byoung-Youl Min, Michael I. Grove, William C. Robinette, Jr. | 1998-08-18 |
| 5508558 | High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion | William C. Robinette, Jr. | 1996-04-16 |
| 5456404 | Method of testing semiconductor chips with reusable test package | William C. Robinette, Jr. | 1995-10-10 |
| 5422514 | Packaging and interconnect system for integrated circuits | Bradley L. Griswold, William C. Robinette, Jr. | 1995-06-06 |
| 5402077 | Bare die carrier | Fariborz Agahdel, Brad Griswold, Syed A. Husain, Robert Moti, William C. Robinette, Jr. | 1995-03-28 |
| 5267867 | Package for multiple removable integrated circuits | Fariborz Agahdel | 1993-12-07 |
| 4812191 | Method of forming a multilevel interconnection device | B. Y. Min | 1989-03-14 |
| 4489364 | Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface | Dudley A. Chance, Alan Platt, Sudipta K. Ray | 1984-12-18 |
| 4430690 | Low inductance MLC capacitor with metal impregnation and solder bar contact | Dudley A. Chance, Timothy C. Reiley | 1984-02-07 |
| 4349862 | Capacitive chip carrier and multilayer ceramic capacitors | Christopher H. Bajorek, Dudley A. Chance | 1982-09-14 |
| 4328530 | Multiple layer, ceramic carrier for high switching speed VLSI chips | Christopher H. Bajorek, Dudley A. Chance, David A. Thompson | 1982-05-04 |
| 4254445 | Discretionary fly wire chip interconnection | — | 1981-03-03 |