Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8143727 | Adhesive on wire stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Young-Kuk Park | 2012-03-27 |
| 8065797 | Fabricating method for printed circuit board | Ryoichi Watanabe, Je-Gwang Yoo, Joon-Sung Kim, Seung Chul KIM, Myung-San Kang | 2011-11-29 |
| 8061025 | Method of manufacturing heat radiation substrate having metal core | Seung Hyun CHO, Soon Jin Cho, Jin Won Choi | 2011-11-22 |
| 8022311 | Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same | Tae Eui Kim, Myung Sam Kang, Je-Gwang Yoo | 2011-09-20 |
| 7888599 | Printed circuit board including embedded capacitor and method of fabricating same | Young Woo Kim, Chang Myung Ryu, Woo Lim Chae, Han Kim | 2011-02-15 |
| 7875340 | Heat radiation substrate having metal core and method of manufacturing the same | Seung Hyun CHO, Soon Jin Cho, Jin Won Choi | 2011-01-25 |
| 7863723 | Adhesive on wire stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Young-Kuk Park | 2011-01-04 |
| 7697301 | Printed circuit board having embedded electronic components and manufacturing method thereof | Doo Hwan Lee, Myung Sam Kang, Moon Il Kim, Hyung Tae Kim | 2010-04-13 |
| 7570491 | Printed circuit board with embedded capacitors therein, and process for manufacturing the same | Seok-Kyu Lee, Chang-Hyun Nam, Hyun-Ju Jin, Jang-Kyu Kang | 2009-08-04 |
| 7485490 | Method of forming a stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Young-Kuk Park | 2009-02-03 |
| 7435911 | Printed circuit board including embedded capacitor and method of fabricating same | Young Woo Kim, Chang Myung Ryu, Woo Lim Chae, Han Kim | 2008-10-14 |
| 7408120 | Printed circuit board having axially parallel via holes | Young Woo Kim, Chang Myung Ryu, Han Kim | 2008-08-05 |
| 7326858 | Printed circuit board with embedded capacitors and manufacturing method thereof | Seok-Kyu Lee, Hyun-Ju Jin, Jang-Kyu Kang | 2008-02-05 |
| 7170384 | Printed circuit board having three-dimensional spiral inductor and method of fabricating same | Han Kim, Young Woo Kim, Young Jae Lee, Chang Myung Ryu | 2007-01-30 |
| 7092237 | Printed circuit board with embedded capacitors therein, and process for manufacturing the same | Seok-Kyu Lee, Jang-Kyu Kang, Hyun-Ju Jin | 2006-08-15 |
| 6910266 | Printed circuit board with embedded capacitors therein, and process for manufacturing the same | Seok-Kyu Lee, Jang-Kyu Kang, Hyun-Ju Jin | 2005-06-28 |
| 6380001 | Flexible pin count package for semiconductor device | Thomas J. Massingill | 2002-04-30 |
| 5847571 | Membrane probing of circuits | Ken Kuang-Fu Liu, Kunio Sano, Takashi Sato | 1998-12-08 |
| 5841291 | Exchangeable membrane probe testing of circuits | Ken Kuang-Fu Liu, Robert Moti, Syed A. Husain | 1998-11-24 |
| 5796164 | Packaging and interconnect system for integrated circuits | Mark T. McGraw, Bradley L. Griswold, Chung W. Ho, Michael I. Grove, William C. Robinette, Jr. | 1998-08-18 |
| 5623213 | Membrane probing of circuits | Ken Kuang-Fu Liu, Robert Moti, Syed A. Husain | 1997-04-22 |