Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9720070 | Communication device and method for controlling the same | Min-Goo Kim, Chae-Hag Yi | 2017-08-01 |
| 9292199 | Function execution method and apparatus thereof | — | 2016-03-22 |
| 9159693 | Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same | — | 2015-10-13 |
| 9142499 | Lead pin for package substrate | Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Gi Sub Lee | 2015-09-22 |
| 8952531 | Packaging method using solder coating ball and package having solder pattern including metal pattern | Yon Ho You | 2015-02-10 |
| 8835302 | Method of fabricating a package substrate | Dong Gyu Lee, Dae-Young Lee, Tae Joon Chung, Seon Jae Mun | 2014-09-16 |
| 8822841 | Package substrate and fabricating method thereof | Dong Gyu Lee, Sung Won Jeong, Dae-Young Lee, Gi Sub Lee, Jin Ho Kim | 2014-09-02 |
| 8785789 | Printed circuit board and method for manufacturing the same | Hueng Jae Oh, Boo Yang Jung, Dae-Young Lee | 2014-07-22 |
| 8766450 | Lead pin for package substrate | Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Gi Sub Lee | 2014-07-01 |
| 8740040 | Solder injection head | Yon Ho You, Ki-ju Lee | 2014-06-03 |
| 8708215 | Solder ball supplying apparatus | Hueng Jae Oh, Yon Ho You | 2014-04-29 |
| 8671564 | Substrate for flip chip bonding and method of fabricating the same | Hueng Jae Oh, Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun | 2014-03-18 |
| 8651356 | Solder bump forming apparatus and soldering facility including the same | Noriaki Mukai, Hueng Jae Oh, Dae-Young Lee | 2014-02-18 |
| 8486760 | Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same | Tae Joon Chung, Dong Gyu Lee, Hueng Jae Oh, Seon Jae Mun | 2013-07-16 |
| 8456003 | Package substrate capable of controlling the degree of warpage | Dong Gyu Lee, Dae-Young Lee, Tae Joon Chung, Seon Jae Mun | 2013-06-04 |
| 8420955 | Lead pin for package substrate | Seung Jean Moon, Ki Taek Lee | 2013-04-16 |
| 8336201 | Method of manufacturing printed circuit board having flow preventing dam | Seung Wan Kim | 2012-12-25 |
| 8159064 | Lead pin for package substrate, and method for manufacturing package substrate with the same | Heung Jae Oh, Ki Taek Lee | 2012-04-17 |
| 8142240 | Lead pin for package substrate | Heung Jae Oh, Ki Taek Lee, Dong Gyu Lee, Sung Won Jeong | 2012-03-27 |
| 8061025 | Method of manufacturing heat radiation substrate having metal core | Seung Hyun CHO, Byoung-Youl Min, Soon Jin Cho | 2011-11-22 |
| 8039761 | Printed circuit board with solder bump on solder pad and flow preventing dam | Seung Wan Kim | 2011-10-18 |
| 7952826 | Method operating hard disk drive on the basis of predicted defect using hierarchical clustering and curve fit | Hristov Stoev Youlian, Nam-guk Kim | 2011-05-31 |
| 7893355 | Lead pin for package boards | Hueng Jae Oh | 2011-02-22 |
| 7875340 | Heat radiation substrate having metal core and method of manufacturing the same | Seung Hyun CHO, Byoung-Youl Min, Soon Jin Cho | 2011-01-25 |
| 7736952 | Wafer packaging method | Soon Jin Cho, Seung Hyun CHO, Chung-Woo Cho, Dong Gyu Lee, Seok Hwan AHN | 2010-06-15 |