Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600430 | Inductor including high-rigidity insulating layers | Jong Yoon Jang, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng | 2023-03-07 |
| 10763031 | Method of manufacturing an inductor | Jong Yoon Jang, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng | 2020-09-01 |
| 10650958 | Coil electronic component | Dae Hui Jo, Han LEE, Mi Sun Hwang, Jeong Min Cho, Myung Sam Kang +1 more | 2020-05-12 |
| 10455708 | Multilayered substrate and method for manufacturing the same | Mi Sun Hwang, Young Gwan Ko, Jong Seok Bae, Myung Sam Kang | 2019-10-22 |
| 10356916 | Printed circuit board with inner layer and outer layers and method of manufacturing the same | Han Kim, Sang Yul Ha, Sung Han Kim, Kyung Ho Lee, Myung Sam Kang | 2019-07-16 |
| 10098232 | Embedded board and method of manufacturing the same | Joon Sung LEE, Yong Sam LEE, Jae Hoon Choi | 2018-10-09 |
| 10045436 | Printed circuit board and method of manufacturing the same | Suk Hyeon Cho, Hyo Seung Nam, Yong Sam LEE | 2018-08-07 |
| 9832866 | Multilayered substrate and method of manufacturing the same | Mi Sun Hwang, Young Gwan Ko, Jong Seok Bae, Myung Sam Kang | 2017-11-28 |
| 9706644 | Printed circuit board and manufacturing method thereof | Sung Han Kim, Han Kim, Mi Sun Hwang, Sang Yul Ha, Kyung Ho Lee | 2017-07-11 |
| 8604345 | Printed circuit board having plating pattern buried in via | Young Gwan Ko | 2013-12-10 |
| 8535547 | Printed circuit board manufacturing system and manufacturing method thereof | Chung-Woo Cho, Soon Jin Cho, Byung-Bae Seo, Ki Young Yoo | 2013-09-17 |
| 8215011 | Method of manufacturing a printed circuit board | Young Gwan Ko | 2012-07-10 |
| 7736952 | Wafer packaging method | Soon Jin Cho, Jin Won Choi, Seung Hyun CHO, Chung-Woo Cho, Dong Gyu Lee | 2010-06-15 |