| 8834077 |
Micro drill and method of fabricating the same |
Tae Sik Yoon, Seung Hyun CHO, Jae Joon Lee |
2014-09-16 |
| 8809122 |
Method of manufacturing flip chip package |
Ey Yong Kim, Young-Hwan Shin, Jong-Yong Kim, Jin Seok Lee |
2014-08-19 |
| 8558360 |
Flip chip package and method of manufacturing the same |
Ey Yong Kim, Young-Hwan Shin, Jong-Yong Kim, Jin Seok Lee |
2013-10-15 |
| 8535547 |
Printed circuit board manufacturing system and manufacturing method thereof |
Chung-Woo Cho, Byung-Bae Seo, Ki Young Yoo, Seok Hwan AHN |
2013-09-17 |
| 8445790 |
Coreless substrate having filled via pad and method of manufacturing the same |
Seok-Kyu Lee, Soon-Oh Jung, Jong-Kuk Hong |
2013-05-21 |
| 8074352 |
Method of manufacturing printed circuit board |
Dong-Jin Park, Seung Hyun Jung, Seung Chul KIM |
2011-12-13 |
| 8061025 |
Method of manufacturing heat radiation substrate having metal core |
Seung Hyun CHO, Byoung-Youl Min, Jin Won Choi |
2011-11-22 |
| 7981728 |
Coreless substrate |
— |
2011-07-19 |
| 7875340 |
Heat radiation substrate having metal core and method of manufacturing the same |
Seung Hyun CHO, Byoung-Youl Min, Jin Won Choi |
2011-01-25 |
| 7736952 |
Wafer packaging method |
Jin Won Choi, Seung Hyun CHO, Chung-Woo Cho, Dong Gyu Lee, Seok Hwan AHN |
2010-06-15 |
| 7517730 |
Coreless substrate and manufacturing method thereof |
— |
2009-04-14 |
| 6400021 |
Wafer level package and method for fabricating the same |
— |
2002-06-04 |
| 6222259 |
Stack package and method of fabricating the same |
Sang Wook Park |
2001-04-24 |
