Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9338887 | Core substrate, manufacturing method thereof, and structure for metal via | Jae Hoon Choi | 2016-05-10 |
| 8499444 | Method of manufacturing a package substrate | Jin Yong An, Chang-Sup Ryu | 2013-08-06 |
| 8445790 | Coreless substrate having filled via pad and method of manufacturing the same | Seok-Kyu Lee, Soon-Oh Jung, Soon Jin Cho | 2013-05-21 |
| 8051559 | Method of manufacturing a multi-layer board | Ki Hwan Kim, Jin Yong An | 2011-11-08 |
| 7971352 | Method of manufacturing printed circuit board | Shuhichi Okabe, Jin Yong An, Seok-Kyu Lee, Soon-Oh Jung, Hae-Nam Seo | 2011-07-05 |
| 7351915 | Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same | Jin-yong Ahn, Chang-Sup Ryu, Suk Hyeon Cho, Seok-Kyu Lee, Ho-Sik Jun | 2008-04-01 |
| 7284317 | Method of producing printed circuit board with embedded resistor | Suk-Hyun Cho, Jang-Kyu Kang, Byung-Kook Sun, Seok-Kyu Lee, Jin-yong Ahn | 2007-10-23 |
| 7277005 | Printed circuit board including embedded resistor and method of fabricating the same | Myung Sam Kang, Chang-Sup Ryu | 2007-10-02 |
| 6683014 | Piezoelectric ceramic composition and piezoelectric ceramic device using the same | Dong Hwan Seo, Kang Heon Hur, Sang Koo Kwon | 2004-01-27 |
| 6656378 | Piezoelectric ceramic composition reducing leakage current and piezoelectric device using the same | Sang Koo Kwon, Kang Heon Hur, Dong Hwan Seo | 2003-12-02 |