Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8633392 | Circuit board with high-density circuit patterns | Myung Sam Kang, Jung-Hyun Park, Hoe-Ku Jung, Jeong Woo Park, Ji Eun Kim | 2014-01-21 |
| 8124880 | Circuit board and method for manufacturing thereof | Myung Sam Kang, Jung-Hyun Park, Hoe-Ku Jung, Jeong Woo Park, Ji Eun Kim | 2012-02-28 |
| 7971352 | Method of manufacturing printed circuit board | Jin Yong An, Seok-Kyu Lee, Soon-Oh Jung, Jong-Kuk Hong, Hae-Nam Seo | 2011-07-05 |
| 7824838 | Method of manufacturing printed circuit board | Ji Hong Jo | 2010-11-02 |
| 7707715 | Method of fabricating multilayer printed circuit board | Je-Gwang Yoo, Chang-Sup Ryu, Myung Sam Kang, Jung-Hyun Park, Ji Hong Jo +2 more | 2010-05-04 |
| 7516545 | Method of manufacturing printed circuit board having landless via hole | Myung Sam Kang, Jung-Hyun Park, Hoe-Ku Jung, Ji Eun Kim | 2009-04-14 |
| 6184479 | Multilayer printed circuit board having a concave metal portion | Keizo Sakurai | 2001-02-06 |
| 6105243 | Method of fabricating multilayer printed circuit board | Keizo Sakurai | 2000-08-22 |
| 5766825 | Method of forming a resin laying in a surface laminated circuit | Masaharu Shirai, Yoshiteru Kohno | 1998-06-16 |