Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9235129 | Composition for photoresist development and method of developing photoresist using the same | Chang Bo LEE, Dae Jo HONG, Hyo Seung Nam | 2016-01-12 |
| 9040838 | Method for forming solder resist and substrate for package | Chang Bo LEE, Hyo-Bin Park, Cheol Ho Choi | 2015-05-26 |
| 8981549 | Multi chip package | Hye Jin Kim, Going Sik Kim | 2015-03-17 |
| 8966746 | Method of fabricating cavity capacitor embedded in printed circuit board | Han Kim, Je-Gwang Yoo | 2015-03-03 |
| 8865393 | Printed circuit board and method of manufacturing the same | Dae Jo HONG, Cheol Ho Choi | 2014-10-21 |
| 8780584 | Printed circuit board and electro application | Han Kim | 2014-07-15 |
| 8592135 | Method of manufacturing printed circuit board | Jee-Soo Mok, Je-Gwang Yoo, Eung-Suek Lee | 2013-11-26 |
| 8499444 | Method of manufacturing a package substrate | Jin Yong An, Jong-Kuk Hong | 2013-08-06 |
| 8432706 | Printed circuit board and electro application | Han Kim | 2013-04-30 |
| 8410373 | Printed circuit substrate and method of manufacturing the same | Hyung Wook Park, Young-Chang Joo, Hong Seok Min, Young Gwan Ko, Ho Young Lee +2 more | 2013-04-02 |
| 8377748 | Method of manufacturing cooling fin and package substrate with cooling fin | Eung-Suek Lee, Je-Gwang Yoo, Jun Oh Hwang, Jun Heyoung Park, Jee-Soo Mok | 2013-02-19 |
| 8310840 | Electromagnetic bandgap structure and printed circuit board | Han Kim, Je-Gwang Yoo | 2012-11-13 |
| 8232478 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure | Han Kim, Je-Gwang Yoo | 2012-07-31 |
| 8198550 | Printed circuit board and method of manufacturing the same | Jee-Soo Mok, Je-Gwang Yoo | 2012-06-12 |
| 8181339 | Method of manufacturing a printed circuit board | Joon-Sung Kim, Je-Gwang Yoo | 2012-05-22 |
| 8169790 | Electromagnetic bandgap structure and printed circuit board | Han Kim, Je-Gwang Yoo | 2012-05-01 |
| 8151446 | Apparatus for manufacturing printed circuit board | Jee-Soo Mok, Je-Gwang Yoo, Yoong Oh, Jong Seok Bae | 2012-04-10 |
| 8039174 | Flexible fuel cell | Hye Yeon Cha, Tae Hoon Kim, Sam Jin Her, Sung Han Kim | 2011-10-18 |
| 8022553 | Mounting substrate and manufacturing method thereof | Jin-yong Ahn, Byung-Youl Min, Myung Sam Kang | 2011-09-20 |
| 8003439 | Board on chip package and manufacturing method thereof | Myung Sam Kang, Jung-Hyun Park, Hoe-Ku Jung, Ji Eun Kim | 2011-08-23 |
| 7983055 | Printed circuit board with embedded cavity capacitor | Han Kim, Je-Gwang Yoo | 2011-07-19 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof | Jee-Soo Mok, Eung-Suek Lee, Youn-Soo Seo, Hee-Bum Shin, Yoong Oh +3 more | 2011-07-05 |
| 7943864 | Printed circuit board having electromagnetic bandgap structure | Han Kim, Hak Sun Kim | 2011-05-17 |
| 7901985 | Method for manufacturing package on package with cavity | Jee-Soo Mok, Dong-Jin Park | 2011-03-08 |
| 7859106 | Multilayer printed circuit board using paste bumps | Yoong Oh, Dong-Jin Park, Jee-Soo Mok, Byung-Bae Seo | 2010-12-28 |