Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8549744 | Printed circuit board using bump and method for manufacturing thereof | Dong-Jin Park, Jee-Soo Mok, Jong-Suk Bae, Ki Hwan Kim | 2013-10-08 |
| 8220149 | Method of manufacturing a printed circuit board | Jeong Ho Moon, Jae-Hyun Eom, Jee-Soo Mok | 2012-07-17 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof | Jee-Soo Mok, Chang-Sup Ryu, Eung-Suek Lee, Youn-Soo Seo, Yoong Oh +3 more | 2011-07-05 |