Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837343 | Chip embedded substrate | Joon-Sung Kim, Yong Ho Baek, Jung-Hyun Cho, Jae Hoon Choi, Young Gwan Ko | 2017-12-05 |
| 9673066 | Apparatus and method of manufacturing semiconductor package module | No Il Park, Seung Wook Park, Tae Sung Jeong | 2017-06-06 |
| 8633396 | Die mounting substrate and method of fabricating the same | Jee-Soo Mok, Jun Oh Hwang | 2014-01-21 |
| 8592135 | Method of manufacturing printed circuit board | Jee-Soo Mok, Je-Gwang Yoo, Chang-Sup Ryu | 2013-11-26 |
| 8415200 | Method for manufacturing semiconductor package | Mi Sun Hwang, Keung Jin Sohn, Myung Sam Kang | 2013-04-09 |
| 8377748 | Method of manufacturing cooling fin and package substrate with cooling fin | Je-Gwang Yoo, Chang-Sup Ryu, Jun Oh Hwang, Jun Heyoung Park, Jee-Soo Mok | 2013-02-19 |
| 8166647 | Method of manufacturing a printed circuit board | Jun Oh Hwang, Jee-Soo Mok, Jun Heyoung Park, Kyung Ah Lee | 2012-05-01 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof | Jee-Soo Mok, Chang-Sup Ryu, Youn-Soo Seo, Hee-Bum Shin, Yoong Oh +3 more | 2011-07-05 |
| 7810232 | Method of manufacturing a circuit board | Keun-Ho Kim, Dek-Gin Yang, Jong Guk Kim, II-Kyoon Jeon | 2010-10-12 |
| 7473099 | Printed circuit board and manufacturing method thereof | Keun-Ho Kim, Dek-Gin Yang, Jong Guk Kim, Il Jeon | 2009-01-06 |