Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8450618 | Printed circuit board with reinforced thermoplastic resin layer | Joon-Sik Shin, Joung Gul Ryu, Jung Hwan Park, Ho-Sik Park, Sang-Youp Lee | 2013-05-28 |
| 8415200 | Method for manufacturing semiconductor package | Mi Sun Hwang, Eung-Suek Lee, Myung Sam Kang | 2013-04-09 |
| 8397378 | Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board | Joon-Sik Shin, Joung Gul Ryu, Jung Hwan Park, Ho-Sik Park, Sang-Youp Lee | 2013-03-19 |
| 8344261 | Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof | Suk Won Lee, Chang Gun Oh | 2013-01-01 |
| 8156635 | Carrier for manufacturing a printed circuit board | Seong Min Cho, Tae Kyun Bae, Hyun Jung HONG, Kyung Ah Lee, Chang Gun Oh | 2012-04-17 |