Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10779414 | Electronic component embedded printed circuit board and method of manufacturing the same | Dong Keun Lee, Jae Hoon Choi, Sang Jae Lee, Sung Taek Lim | 2020-09-15 |
| 10529476 | Coil component and method for manufacturing the same | Sang Jae Lee, Youn-Soo Seo, Yong Sam LEE, Hye Yeon Cha, Jae Ha Kim | 2020-01-07 |
| 9674944 | Printed circuit board and manufacturing method thereof | Byung Moon Kim, Dong Keun Lee, Sung Jun Lee | 2017-06-06 |
| 8997340 | Method of manufacturing and insulating sheet | Keungjin Sohn, Nobuyuki Ikeguchi, Joung Gul Ryu, Sang-Youp Lee, Joon-Sik Shin +1 more | 2015-04-07 |
| 8720049 | Printed circuit board and method for fabricating the same | Tae Kyun Bae, Chang Gun Oh | 2014-05-13 |
| 8647926 | Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip | Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung Gul Ryu, Sang-Youp Lee +1 more | 2014-02-11 |
| 8499441 | Method of manufacturing a printed circuit board | Jung Hwan Park, Keungjin Sohn, Joon-Sik Shin, Sang-Youp Lee, Joung Gul Ryu | 2013-08-06 |
| 8450618 | Printed circuit board with reinforced thermoplastic resin layer | Keung Jin Sohn, Joon-Sik Shin, Joung Gul Ryu, Jung Hwan Park, Sang-Youp Lee | 2013-05-28 |
| 8397378 | Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board | Keung Jin Sohn, Joon-Sik Shin, Joung Gul Ryu, Jung Hwan Park, Sang-Youp Lee | 2013-03-19 |
| 8356405 | Method of manufacturing printed circuit board | Chang Gun Oh, Tae Kyun Bae | 2013-01-22 |
| 7893527 | Semiconductor plastic package and fabricating method thereof | Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung Gul Ryu, Sang-Youp Lee +1 more | 2011-02-22 |