Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8997340 | Method of manufacturing and insulating sheet | Nobuyuki Ikeguchi, Joung Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin +1 more | 2015-04-07 |
| 8647926 | Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip | Joon-Sik Shin, Nobuyuki Ikeguchi, Joung Gul Ryu, Sang-Youp Lee, Jung Hwan Park +1 more | 2014-02-11 |
| 8499441 | Method of manufacturing a printed circuit board | Jung Hwan Park, Joon-Sik Shin, Sang-Youp Lee, Ho-Sik Park, Joung Gul Ryu | 2013-08-06 |
| 8174128 | Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method | Nobuyuki Ikeguchi, JoonSik Shin, Jung Hwan Park | 2012-05-08 |
| 8030752 | Method of manufacturing semiconductor package and semiconductor plastic package using the same | Nobuyuki Ikeguchi, JoonSik Shin, Jung Hwan Park | 2011-10-04 |
| 7893527 | Semiconductor plastic package and fabricating method thereof | Joon-Sik Shin, Nobuyuki Ikeguchi, Joung Gul Ryu, Sang-Youp Lee, Jung Hwan Park +1 more | 2011-02-22 |