Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174128 | Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method | Nobuyuki Ikeguchi, Keungjin Sohn, Jung Hwan Park | 2012-05-08 |
| 8030752 | Method of manufacturing semiconductor package and semiconductor plastic package using the same | Nobuyuki Ikeguchi, Keungjin Sohn, Jung Hwan Park | 2011-10-04 |