Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9211592 | Lubricant sheet for drilling and method of drilling | Takuya Hasaki, Shinya Komatsu, Toshihiko Kobayashi, Mitsuo Ejiri | 2015-12-15 |
| 8997340 | Method of manufacturing and insulating sheet | Keungjin Sohn, Joung Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin +1 more | 2015-04-07 |
| 8647926 | Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip | Joon-Sik Shin, Keungjin Sohn, Joung Gul Ryu, Sang-Youp Lee, Jung Hwan Park +1 more | 2014-02-11 |
| 8377544 | Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity | Morio Gaku, Hidenori Kimbara, Masakazu Motegi | 2013-02-19 |
| 8174128 | Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method | Keungjin Sohn, JoonSik Shin, Jung Hwan Park | 2012-05-08 |
| 8030752 | Method of manufacturing semiconductor package and semiconductor plastic package using the same | Keungjin Sohn, JoonSik Shin, Jung Hwan Park | 2011-10-04 |
| 7893527 | Semiconductor plastic package and fabricating method thereof | Joon-Sik Shin, Keungjin Sohn, Joung Gul Ryu, Sang-Youp Lee, Jung Hwan Park +1 more | 2011-02-22 |
| 6866919 | Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof | Morio Mori | 2005-03-15 |
| 6750422 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Morio Gaku, Yasuo Tanaka, Yoshihiro Kato | 2004-06-15 |
| 6736988 | Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board | Morio Gaku, Yoshihiro Kato, Taro Yoshida | 2004-05-18 |
| 6720651 | Semiconductor plastic package and process for the production thereof | Morio Gaku, Nobuyuki Yamane | 2004-04-13 |
| 6708404 | Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole | Morio Gaku, Yoshihiro Kato, Hiroki Aoto | 2004-03-23 |
| 6680152 | Photosensitive resin composition | Kenji Ishii, Takabumi Omori, Daisuke Ohno | 2004-01-20 |
| 6562179 | High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these | Masahiro Shimoda | 2003-05-13 |
| 6528552 | Resist composition excellent in flame resistance | Takabumi Omori, Kenji Ishii, Toru Harada | 2003-03-04 |
| 6479760 | Printed wiring board for semiconductor plastic package | Hidenori Kimbara, Katsuji Komatsu | 2002-11-12 |
| 6396143 | Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board | Hidenori Kimbara, Katsuji Komatsu | 2002-05-28 |
| 6376908 | Semiconductor plastic package and process for the production thereof | Morio Gaku, Nobuyuki Yamane | 2002-04-23 |
| 6362436 | Printed wiring board for semiconductor plastic package | Hidenori Kimbara, Katsuji Komatsu | 2002-03-26 |
| 6350952 | Semiconductor package including heat diffusion portion | Morio Gaku, Toshihiko Kobayashi | 2002-02-26 |
| 6337463 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Morio Gaku, Yasuo Tanaka, Yoshihiro Kato | 2002-01-08 |
| 6280641 | Printed wiring board having highly reliably via hole and process for forming via hole | Morio Gaku, Yasuo Tanaka | 2001-08-28 |
| 6265767 | Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package | Morio Gaku, Toshihiko Kobayashi | 2001-07-24 |
| 6097089 | Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package | Morio Gaku, Toshihiko Kobayashi | 2000-08-01 |
| 4717609 | Adhesive composition and adhesive film or sheet on which the composition is coated | Morio Gaku, Hidenori Kimbara | 1988-01-05 |