Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8377544 | Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity | Morio Gaku, Hidenori Kimbara, Nobuyuki Ikeguchi | 2013-02-19 |
| 4917758 | Method for preparing thin copper foil-clad substrate for circuit boards | Koichi Ishizuka, Morio Gaku, Kenzi Ishii, Hidenori Kinbara | 1990-04-17 |
| 4904760 | Thermosetting resin composition from cyanate ester and non-branched aromatic compound | Morio Gaku, Hidenori Kimbara, Mitsuo Eziri, Yousuke Funamoto | 1990-02-27 |