Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8377544 | Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity | Hidenori Kimbara, Nobuyuki Ikeguchi, Masakazu Motegi | 2013-02-19 |
| 7989081 | Resin composite copper foil, printed wiring board, and production processes thereof | Mitsuru Nozaki, Yasuo Tanaka, Eiji Nagata, Yasuo Kikuchi, Masashi Yano | 2011-08-02 |
| 7140103 | Process for the production of high-density printed wiring board | Nobuyuk Ikeguchi, Katsuji Komatsu, Yasuo Tanaka, Keiichi Iwata, Ken Shimizu | 2006-11-28 |
| 6750422 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Nobuyuki Ikeguchi, Yasuo Tanaka, Yoshihiro Kato | 2004-06-15 |
| 6736988 | Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board | Nobuyuki Ikeguchi, Yoshihiro Kato, Taro Yoshida | 2004-05-18 |
| 6720651 | Semiconductor plastic package and process for the production thereof | Nobuyuki Ikeguchi, Nobuyuki Yamane | 2004-04-13 |
| 6708404 | Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole | Nobuyuki Ikeguchi, Yoshihiro Kato, Hiroki Aoto | 2004-03-23 |
| 6376908 | Semiconductor plastic package and process for the production thereof | Nobuyuki Ikeguchi, Nobuyuki Yamane | 2002-04-23 |
| 6350952 | Semiconductor package including heat diffusion portion | Nobuyuki Ikeguchi, Toshihiko Kobayashi | 2002-02-26 |
| 6337463 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Nobuyuki Ikeguchi, Yasuo Tanaka, Yoshihiro Kato | 2002-01-08 |
| 6280641 | Printed wiring board having highly reliably via hole and process for forming via hole | Nobuyuki Ikeguchi, Yasuo Tanaka | 2001-08-28 |
| 6265767 | Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package | Nobuyuki Ikeguchi, Toshihiko Kobayashi | 2001-07-24 |
| 6229096 | Nonwoven reinforcement for printed wiring base board and process for producing the same | Mitsuru Nozaki, Kenji Saimen, Tamemaru Esaki | 2001-05-08 |
| 6097089 | Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package | Nobuyuki Ikeguchi, Toshihiko Kobayashi | 2000-08-01 |
| 5186880 | Process for producing cyanate ester resin cure product | Mitsuru Nozaki | 1993-02-16 |
| 5160787 | Electrical laminate having ability to absorb ultraviolet rays | Kenzi Ishii, Takamasa Nakai | 1992-11-03 |
| 5082402 | Method of drilling of through-holes in printed circuit board panels | Hidenori Kimbara | 1992-01-21 |
| 5076864 | Process for producing multilayer printed wiring board | Yasuo Tanaka, Naohito Yoshimura, Koichi Nakano, Touru Nohtomi | 1991-12-31 |
| 4937132 | Laminating material for printed circuit board of low dielectric constant | Hidenori Kinbara | 1990-06-26 |
| 4917758 | Method for preparing thin copper foil-clad substrate for circuit boards | Koichi Ishizuka, Kenzi Ishii, Hidenori Kinbara, Masakazu Motegi | 1990-04-17 |
| 4904760 | Thermosetting resin composition from cyanate ester and non-branched aromatic compound | Hidenori Kimbara, Mitsuo Eziri, Masakazu Motegi, Yousuke Funamoto | 1990-02-27 |
| 4871811 | Hot melt adhesive composition | Hidenori Kinbara | 1989-10-03 |
| 4820769 | Hot melt adhesive composition | Hidenori Kinbara | 1989-04-11 |
| 4820855 | Process for producing polyfunctional cyanate ester polymer | Hidenori Kimbara | 1989-04-11 |
| 4785034 | Polyolefin resin composition | Hidenori Kimbara, Akira Yahagi, Takaaki Osanai | 1988-11-15 |