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Eiji Nagata

PC Pi R&D Co.: 4 patents #6 of 41Top 15%
MC Mitsubishi Gas Chemical Company: 3 patents #605 of 1,727Top 40%
Sumitomo Electric Industries: 3 patents #7,735 of 21,551Top 40%
NE Nec: 2 patents #5,510 of 14,502Top 40%
Overall (All Time): #567,845 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
9949371 Resin composite electrolytic copper foil, copper clad laminate and printed wiring board Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Masashi Yano 2018-04-17
8771496 Process for producing metal composite film Hiroyuki Ishii 2014-07-08
7989081 Resin composite copper foil, printed wiring board, and production processes thereof Mitsuru Nozaki, Morio Gaku, Yasuo Tanaka, Yasuo Kikuchi, Masashi Yano 2011-08-02
7892651 Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate Takabumi Omori, Mitsuru Nozaki, Masashi Yano 2011-02-22
7346871 Method of estimating wiring complexity degree in semiconductor integrated circuit Fumihito Watanuki 2008-03-18
7146550 Isolation testing circuit and testing circuit optimization method 2006-12-05
6882175 Inter-block interface circuit and system LSI Isao Motegi 2005-04-19
4841353 Transistor devices for microwave oscillator elements Kenzo Wada 1989-06-20
4736168 Dielectric resonator controlled oscillator having a raised frequency multiplying efficiency 1988-04-05