Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9949371 | Resin composite electrolytic copper foil, copper clad laminate and printed wiring board | Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano | 2018-04-17 |
| 7989081 | Resin composite copper foil, printed wiring board, and production processes thereof | Morio Gaku, Yasuo Tanaka, Eiji Nagata, Yasuo Kikuchi, Masashi Yano | 2011-08-02 |
| 7892651 | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate | Takabumi Omori, Eiji Nagata, Masashi Yano | 2011-02-22 |
| 7192651 | Resin composition and prepreg for laminate and metal-clad laminate | Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo +1 more | 2007-03-20 |
| 6229096 | Nonwoven reinforcement for printed wiring base board and process for producing the same | Morio Gaku, Kenji Saimen, Tamemaru Esaki | 2001-05-08 |
| 5692940 | Sheet material for laminate of printed circuit and laminate for printed circuit using the same | Hidenori Kinbara, Masanobu Mizoguchi, Koji Kimura, Naohiko Shimono | 1997-12-02 |
| 5186880 | Process for producing cyanate ester resin cure product | Morio Gaku | 1993-02-16 |
| 4764327 | Process of producing plastic-molded printed circuit boards | Hirokatsu Nakamura | 1988-08-16 |
| 4740343 | Method for producing rigid resin molds | Morio Gaku, Hidenori Kimbara, Jun Yokoi, Yasunari Osaki | 1988-04-26 |