Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5692940 | Sheet material for laminate of printed circuit and laminate for printed circuit using the same | Mitsuru Nozaki, Masanobu Mizoguchi, Koji Kimura, Naohiko Shimono | 1997-12-02 |
| 5480269 | Method of drilling a hole for printed wiring board | Mitsuo Ejiri | 1996-01-02 |
| 4937132 | Laminating material for printed circuit board of low dielectric constant | Morio Gaku | 1990-06-26 |
| 4917758 | Method for preparing thin copper foil-clad substrate for circuit boards | Koichi Ishizuka, Morio Gaku, Kenzi Ishii, Masakazu Motegi | 1990-04-17 |
| 4871811 | Hot melt adhesive composition | Morio Gaku | 1989-10-03 |
| 4820769 | Hot melt adhesive composition | Morio Gaku | 1989-04-11 |
| 4383903 | Curable resin composition | Satoshi Ayano, Morio Gaku, Nobuyuki Ikeguchi, Yasunari Osaki | 1983-05-17 |