Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7140103 | Process for the production of high-density printed wiring board | Morio Gaku, Nobuyuk Ikeguchi, Yasuo Tanaka, Keiichi Iwata, Ken Shimizu | 2006-11-28 |
| 6479760 | Printed wiring board for semiconductor plastic package | Hidenori Kimbara, Nobuyuki Ikeguchi | 2002-11-12 |
| 6396143 | Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board | Hidenori Kimbara, Nobuyuki Ikeguchi | 2002-05-28 |
| 6362436 | Printed wiring board for semiconductor plastic package | Hidenori Kimbara, Nobuyuki Ikeguchi | 2002-03-26 |
| 6031292 | Semiconductor device, interposer for semiconductor device | Gen Murakami, Mamoru Mita, Toyohiko Kumakura, Norio Okabe, Shoji Shinzawa | 2000-02-29 |
| 5866948 | Interposer for semiconductor device | Gen Murakami, Mamoru Mita, Toyohiko Kumakura, Norio Okabe, Shoji Shinzawa | 1999-02-02 |
| 5289039 | Resin encapsulated semiconductor device | Yoshihiro Ishida, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa +1 more | 1994-02-22 |
| 5233225 | Resin encapsulated pin grid array and method of manufacturing the same | Yoshihiro Ishida, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa +1 more | 1993-08-03 |
| 5179039 | Method of making a resin encapsulated pin grid array with integral heatsink | Yoshihiro Ishida, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa +1 more | 1993-01-12 |
| 5108955 | Method of making a resin encapsulated pin grid array with integral heatsink | Yoshihiro Ishida, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa +1 more | 1992-04-28 |
| 4954308 | Resin encapsulating method | Isao Yabe, Hiroyuki Kaneko | 1990-09-04 |