| 8230591 |
Method for fabricating an electronic device substrate |
Akira Chinda, Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida |
2012-07-31 |
|
| 8101864 |
Electronic device substrate and its fabrication method, and electronic device and its fabrication method |
Akira Chinda, Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida |
2012-01-24 |
$151,000 |
| 7888697 |
Lead frame, method of making the same and light receiving/emitting device |
Tadashi Kawanobe, Yuichi Ohnuma |
2011-02-15 |
|
| 7780836 |
Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
Akira Chinda, Nobuaki Miyamoto |
2010-08-24 |
$77,000 |
| 7268408 |
Wiring board, method for manufacturing wiring board and electronic component using wiring board |
Akira Chinda, Akira Matsuura, Takayuki Yoshiwa, Takashi Kageyama, Katsutoshi Taga |
2007-09-11 |
$144,000 |
| 7202570 |
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same |
Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii +9 more |
2007-04-10 |
$231,000 |
| 7038325 |
Wiring tape for semiconductor device including a buffer layer having interconnected foams |
Masahiko Ogino, Shuji Eguchi, Akira Nagai, Takumi Ueno, Masanori Segawa +6 more |
2006-05-02 |
$138,000 |
| 6791194 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii +9 more |
2004-09-14 |
$175,000 |
| 6506627 |
Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device |
Gen Murakamz, Norio Okabe, Yasuharu Kameyama |
2003-01-14 |
$192,000 |
| 6433409 |
Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same |
Gen Murakami |
2002-08-13 |
$95,000 |
| 6433440 |
Semiconductor device having a porous buffer layer for semiconductor device |
Masahiko Ogino, Shuji Eguchi, Akira Nagai, Takumi Ueno, Masanori Segawa +6 more |
2002-08-13 |
$95,000 |
| 6426548 |
Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same |
Gen Murakami |
2002-07-30 |
$311,000 |
| 6323058 |
Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device |
Gen Murakamz, Norio Okabe, Yasuharu Kameyama |
2001-11-27 |
$282,000 |
| 6297073 |
Semiconductor device |
Makoto Kitano, Ryuji Kohno, Naotaka Tanaka, Akihiro Yaguchi, Tetsuo Kumazawa +5 more |
2001-10-02 |
$300,000 |
| 6297142 |
Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy |
Gen Murakami |
2001-10-02 |
$300,000 |
| 6137185 |
Electrode structure of a wiring substrate of semiconductor device having expanded pitch |
Masakazu Ishino, Ryohei Satoh |
2000-10-24 |
$1,035,000 |
| 6130112 |
Semiconductor device |
Makoto Kitano, Ryuji Kohno, Naotaka Tanaka, Akihiro Yaguchi, Tetsuo Kumazawa +5 more |
2000-10-10 |
$736,000 |
| 6114753 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii +9 more |
2000-09-05 |
$694,000 |
| 6049128 |
Semiconductor device |
Makoto Kitano, Ryuji Kohno, Naotaka Tanaka, Akihiro Yaguchi, Tetsuo Kumazawa +5 more |
2000-04-11 |
$636,000 |
| 6031292 |
Semiconductor device, interposer for semiconductor device |
Gen Murakami, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa |
2000-02-29 |
$408,000 |
| 5886409 |
Electrode structure of wiring substrate of semiconductor device having expanded pitch |
Masakazu Ishino, Ryohei Satoh |
1999-03-23 |
$330,000 |
| 5866948 |
Interposer for semiconductor device |
Gen Murakami, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa |
1999-02-02 |
$397,000 |
| 5837154 |
Method of manufacturing double-sided circuit tape carrier |
Norio Okabe, Yasuharu Kameyama, Katsutoshi Taga, Takayuki Sato, Hiroki Tanaka +1 more |
1998-11-17 |
$224,000 |
| 5589668 |
Multi-metal layer wiring tab tape carrier and process for fabricating the same |
Kenji Yamaguchi, Shoji Takagi, Sadahiko Mitsugi, Tomio Murakami |
1996-12-31 |
$102,000 |
| 5428889 |
Method for manufacturing composite lead frame |
Tomio Murakami, Shoji Takagi, Hiroki Tanaka, Kenji Yamaguchi |
1995-07-04 |
|
