Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8230591 | Method for fabricating an electronic device substrate | Akira Chinda, Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida | 2012-07-31 |
| 8101864 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Akira Chinda, Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida | 2012-01-24 |
| 7888697 | Lead frame, method of making the same and light receiving/emitting device | Tadashi Kawanobe, Yuichi Ohnuma | 2011-02-15 |
| 7780836 | Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same | Akira Chinda, Nobuaki Miyamoto | 2010-08-24 |
| 7268408 | Wiring board, method for manufacturing wiring board and electronic component using wiring board | Akira Chinda, Akira Matsuura, Takayuki Yoshiwa, Takashi Kageyama, Katsutoshi Taga | 2007-09-11 |
| 7202570 | Circuit tape having adhesive film semiconductor device and a method for manufacturing the same | Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii +9 more | 2007-04-10 |
| 7038325 | Wiring tape for semiconductor device including a buffer layer having interconnected foams | Masahiko Ogino, Shuji Eguchi, Akira Nagai, Takumi Ueno, Masanori Segawa +6 more | 2006-05-02 |
| 6791194 | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii +9 more | 2004-09-14 |
| 6506627 | Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device | Gen Murakamz, Norio Okabe, Yasuharu Kameyama | 2003-01-14 |
| 6433409 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | Gen Murakami | 2002-08-13 |
| 6433440 | Semiconductor device having a porous buffer layer for semiconductor device | Masahiko Ogino, Shuji Eguchi, Akira Nagai, Takumi Ueno, Masanori Segawa +6 more | 2002-08-13 |
| 6426548 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | Gen Murakami | 2002-07-30 |
| 6323058 | Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device | Gen Murakamz, Norio Okabe, Yasuharu Kameyama | 2001-11-27 |
| 6297073 | Semiconductor device | Makoto Kitano, Ryuji Kohno, Naotaka Tanaka, Akihiro Yaguchi, Tetsuo Kumazawa +5 more | 2001-10-02 |
| 6297142 | Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy | Gen Murakami | 2001-10-02 |
| 6137185 | Electrode structure of a wiring substrate of semiconductor device having expanded pitch | Masakazu Ishino, Ryohei Satoh | 2000-10-24 |
| 6130112 | Semiconductor device | Makoto Kitano, Ryuji Kohno, Naotaka Tanaka, Akihiro Yaguchi, Tetsuo Kumazawa +5 more | 2000-10-10 |
| 6114753 | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii +9 more | 2000-09-05 |
| 6049128 | Semiconductor device | Makoto Kitano, Ryuji Kohno, Naotaka Tanaka, Akihiro Yaguchi, Tetsuo Kumazawa +5 more | 2000-04-11 |
| 6031292 | Semiconductor device, interposer for semiconductor device | Gen Murakami, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa | 2000-02-29 |
| 5886409 | Electrode structure of wiring substrate of semiconductor device having expanded pitch | Masakazu Ishino, Ryohei Satoh | 1999-03-23 |
| 5866948 | Interposer for semiconductor device | Gen Murakami, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa | 1999-02-02 |
| 5837154 | Method of manufacturing double-sided circuit tape carrier | Norio Okabe, Yasuharu Kameyama, Katsutoshi Taga, Takayuki Sato, Hiroki Tanaka +1 more | 1998-11-17 |
| 5589668 | Multi-metal layer wiring tab tape carrier and process for fabricating the same | Kenji Yamaguchi, Shoji Takagi, Sadahiko Mitsugi, Tomio Murakami | 1996-12-31 |
| 5428889 | Method for manufacturing composite lead frame | Tomio Murakami, Shoji Takagi, Hiroki Tanaka, Kenji Yamaguchi | 1995-07-04 |