Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11382217 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-07-05 |
| 11375624 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-06-28 |
| 11337315 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-05-17 |
| 11337314 | Surface treated copper foil, copper clad laminate, and printed circuit board | Atsushi Miki | 2022-05-17 |
| 10356898 | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | — | 2019-07-16 |
| 10349531 | Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method | Michiya Kohiki | 2019-07-09 |
| 10299385 | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | — | 2019-05-21 |
| 10251283 | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | — | 2019-04-02 |
| 9955583 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | Masafumi Ishii, Misato Honda | 2018-04-24 |
| 8230588 | Method of making an electronic device and electronic device substrate | Akira Chinda, Koki Hirasawa, Kenji Uchida | 2012-07-31 |
| 8230591 | Method for fabricating an electronic device substrate | Akira Chinda, Koki Hirasawa, Kenji Uchida, Mamoru Mita | 2012-07-31 |
| 8101864 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Akira Chinda, Koki Hirasawa, Kenji Uchida, Mamoru Mita | 2012-01-24 |
| 7939935 | Electronic device substrate, electronic device and methods for fabricating the same | Akira Chinda, Koki Hirasawa, Kenji Uchida | 2011-05-10 |
| 7880091 | Electronic device substrate, electronic device and methods for making same | Akira Chinda, Koki Hirasawa, Kenji Uchida | 2011-02-01 |
| 7780836 | Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same | Akira Chinda, Mamoru Mita | 2010-08-24 |
| 7705245 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Akira Chinda, Koki Hirasawa, Kenji Uchida | 2010-04-27 |
| 7681310 | Method for fabricating double-sided wiring board | Akira Chinda | 2010-03-23 |
| 4402931 | Process for producing manganese dioxide | Isao Tanabe, Ryoichi Nagata, Toru Watanabe | 1983-09-06 |