Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10349531 | Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method | Nobuaki Miyamoto | 2019-07-09 |
| 10257938 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | — | 2019-04-09 |
| 10187983 | Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board | Tomota Nagaura | 2019-01-22 |
| 10178775 | Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board | Yoshiyuki Miyoshi, Masafumi Ishii | 2019-01-08 |
| 9930776 | Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layer | — | 2018-03-27 |
| 9839124 | Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board | — | 2017-12-05 |
| 9788423 | Copper foil with carrier | Tomota Nagaura, Terumasa Moriyama | 2017-10-10 |
| 9578741 | Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board | Tomota Nagaura, Terumasa Moriyama | 2017-02-21 |
| 9028972 | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board | Terumasa Moriyama | 2015-05-12 |
| 8721864 | Process and apparatus for producing a metal covered polyimide composite | Naonori Michishita, Nobuhito Makino | 2014-05-13 |
| 8568899 | Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board | Naonori Michishita, Nobuhito Makino | 2013-10-29 |