Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401612 | Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus | — | 2022-08-02 |
| 10332756 | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | Tomota Nagaura | 2019-06-25 |
| 10123433 | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | Tomota Nagaura | 2018-11-06 |
| 9788423 | Copper foil with carrier | Tomota Nagaura, Michiya Kohiki | 2017-10-10 |
| 9578741 | Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board | Tomota Nagaura, Michiya Kohiki | 2017-02-21 |
| 9028972 | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board | Michiya Kohiki | 2015-05-12 |
| 8142905 | Copper foil for printed circuit board and copper clad laminate for printed circuit board | Kengo Kaminaga | 2012-03-27 |