Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12054822 | Sputtering target product and method for producing recycled sputtering target product | Keijiro Sugimoto, Yuki Yamada, Shuhei Murata | 2024-08-06 |
| 9060431 | Liquid crystal polymer copper-clad laminate and copper foil used for said laminate | Hideta Arai, Atsushi Miki, Ryo Fukuchi | 2015-06-16 |
| 8668994 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same | Keisuke Yamanishi, Ryo Fukuchi | 2014-03-11 |
| 8580390 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same | Keisuke Yamanishi, Ryo Fukuchi | 2013-11-12 |
| 8357307 | Method of forming electronic circuit | Keisuke Yamanishi, Ryo Fukuchi | 2013-01-22 |
| 8142905 | Copper foil for printed circuit board and copper clad laminate for printed circuit board | Terumasa Moriyama | 2012-03-27 |