Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10925170 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Atsushi Miki, Ryo Fukuchi | 2021-02-16 |
| 10925171 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device | Yuki Ori, Atsushi Miki, Ryo Fukuchi | 2021-02-16 |
| 10820414 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Ryo Fukuchi, Atsushi Miki | 2020-10-27 |
| 10791631 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Atsushi Miki, Ryo Fukuchi | 2020-09-29 |
| 10529992 | Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil | Atsushi Miki | 2020-01-07 |
| 10472728 | Copper foil for printed circuit | Atsushi Miki | 2019-11-12 |
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Ryo Fukuchi, Atsushi Miki | 2019-11-05 |
| 10383222 | Surface-treated copper foil | Atsushi Miki, Ryo Fukuchi | 2019-08-13 |
| 10194534 | Printed wiring board, electronic device, catheter, and metallic material | Atsushi Miki, Satoru Morioka | 2019-01-29 |
| 9724896 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Ryo Fukuchi, Atsushi Miki | 2017-08-08 |
| 9730332 | Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate | Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro | 2017-08-08 |
| 9580829 | Copper foil for printed circuit | Atsushi Miki | 2017-02-28 |
| 9504149 | Surface treated copper foil and laminate using the same | Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro | 2016-11-22 |
| 9232650 | Surface treated copper foil and laminate using the same | Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro | 2016-01-05 |
| 9060431 | Liquid crystal polymer copper-clad laminate and copper foil used for said laminate | Kengo Kaminaga, Atsushi Miki, Ryo Fukuchi | 2015-06-16 |
| 9049795 | Rolled copper or copper-alloy foil provided with roughened surface | Atsushi Miki | 2015-06-02 |
| 8524378 | Copper foil for printed circuit | Naoki Higuchi | 2013-09-03 |
| 6319621 | Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same | Kazuhiko Sakaguchi | 2001-11-20 |